Lehighton-2000M Sheet Resistance and Mobility Measurement
This non-contact, non-destructive system is designed to characterize charge carrier mobility and sheet resistance of compound semiconductor wafers up to 200 mm in diameter. It combines RF reflectance with a permanent magnet for mobility measurement and Eddy Probe technology for sheet resistance analysis. With high throughput and full-wafermapping, it delivers uniformity analysis essential for semiconductor manufacturing and R&D.
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