Impact of Laser Anneal Thermal Budget on the Quality of Thin SiGe Channels with a High Ge Content
Published to: International Conference on Advanced Thermal Processing of Semiconductors RTP), 2010
Year: 2010
Author: E. Rosseel, A. Hikavyy, J-L. Everaert, L. Witters, J. Mitard, T. Hoffmann, W. Vandervorst, A. Pap, T. Pavelka
Ge-Si alloysX-ray diffractionelemental semiconductorslaser beam annealingsemiconductor epitaxial layerssemiconductor junctionsSilicon (Si)
Read publicationWe explore the limits of sub-melt laser annealing on blanket SiGe/Si-cap layers with Ge concentrations up to 55% using High-Resolution X-ray Diffraction (HR-XRD) and a new non-contact metrology to measure the mobility of inversion charges. We discuss the influence of the laser peak temperature and SiGe/Si stack parameters. It is shown that for high Ge concentrations and SiGe/Si-cap thicknesses of interest, the standard laser anneal thermal budget needs to be limited to avoid excessive relaxation and to preserve the mobility enhancement.
