Quantitative Copper Measurement in Oxidized p-Type Silicon Wafers using Microwave Photoconductivity Decay

We propose a method to measure trace copper contamination in p-type silicon using the microwave photoconductivity decay (⁠μ-PCD) technique. The method is based on the precipitation of interstitial copper, activated by high-intensity light, which results in enhanced minority carrier recombination activity. We show that there is a quantitative correlation between the enhanced recombination rate and the Cu concentration by comparing μ-PCD measurements with transient ion drift and total reflection x-ray fluorescence measurements. The results indicate that the method is capable of measuring Cu concentrations down to 1010cm−3⁠. There are no limitations to wafer storage time if corona charge is used on the oxidized wafer surfaces as the charge prevents copper outdiffusion. We briefly discuss the role of oxide precipitates both in the copper precipitation and in the charge carrier recombination processes.